Electronics. Structural Bonding Application
Structural Bonding for Increased Device Stability

Structural Bonding for Increased Device Stability

Increased device stability with our structural bonding solutions: tesa HAF®.



Superior Bonding Strength Even on Small Bonding Areas

Electronic devices are becoming more and more miniaturized and sophisticated. Complex designs require smaller bonding areas as well as higher tape performance. Our tesa HAF® tapes are successfully used in many of these applications and offer not only superior bonding strength and shock resistance but also durability and environmental resistance on a broad variety of substrates. Because of these features, our adhesive tapes meet all the requirements of structural bonding.

Anti-Repulsion
Fabric Mounting
Logo Mounting
Anti-Repulsion
Fabric Mounting
Logo Mounting

Applications Examples

  • FPC stiffening
  • Frame mounting/enclosure assembly
  • Magnesium bracket mounting

Our Solutions

  • tesa reactive HAF®
  • tesa anti-shock reactive HAF®
  • tesa low-temperature reactive HAF®
  • tesa thermoplastic HAF®
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Products

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tesa® 8444

Specifications
none
copolyester
3.93 mils

tesa® HAF 8454 E&E

Specifications
none
nitrile rubber / phenolic resin
3.93 mils

tesa® 8462

Specifications
none
copolyester
1.96 mils

tesa® 8466

Specifications
non-woven
copolyester
5.90 mils

tesa® HAF 8471

Specifications
none
nitrile rubber / phenolic resin
1.18 mils

tesa® HAF 8472

Specifications
none
nitrile rubber / phenolic resin
2.36 mils

tesa® HAF 8473

Specifications
none
nitrile rubber / phenolic resin
3.14 mils

tesa® HAF 8474

Specifications
none
nitrile rubber / phenolic resin
3.93 mils

tesa® HAF 8475

Specifications
none
nitrile rubber / phenolic resin
4.92 mils

tesa® HAF 8478

Specifications
none
nitrile rubber / phenolic resin
7.87 mils

tesa® HAF 58474

Specifications
none
nitrile rubber / phenolic resin
3.93 mils

tesa® HAF 58478

Specifications
none
nitrile rubber / phenolic resin
7.87 mils

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